The February 2010 issue of Controlled Environments magazine contained an article written by Entegris researchers Huaping Wang, Yinkai Liu and Mike Cisewski. The article is titled "Purge Microenvironments with Ionized Air to Reduce Chances of ESD Damage to Wafers." Here is a synopsis of the information presented:

"Many fabs are starting to purge microenvironments with clean dry nitrogen or extreme clean dry air between certain critical processes so as to reduce oxygen, moisture and other airborne molecular contaminants. Microenvironments with features such as inlet and outlet ports, filters, and check valves have been manufactured to facilitate an automatic purge in fabs; however, there is an opportunity to add one more benefit: electrostatic charge neutralization. By adding an ionization module to the purge gas supply line, fabs can fill the microenvironment with ionized gas to neutralize the charges on wafers."

As an added bonus, the test setup for this paper was shown on the cover of this publication.

Entegris was recently interviewed by Solid State Technology Editorial Director Pete Singer to discuss a new technology development program. The technology, to more accurately measure particles smaller than 30 nm was developed by Entegris' Analytical Services groups in Japan and the United States, advances the state-of-the-art technology available in the manufacturing of liquid filters. Within the interview Vinay and Pete also discuss various aspects of filtration technology and the need for advancements in sub-30 nm filtration testing technology as roadmap objectives require more advanced contamination control.

Watch the video of Pete Singer's interview.

Click here to learn more about Fluorescence Spectroscopy (FS) sub-30 nm retention test method.